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Builder’s Guide for AMD Opteron™ Processor-Based
Servers and Workstations
30925 Rev. 3.04 February 2004
34 Hardware Considerations
Chapter 5
Note: To calculate the processor current at 12-V VRM source:
25.1
12
current coreprocessor voltagecoreprocessor
I ×
×
=
Where 12 = VRM source voltage and 1.25 is the reciprocal of the 80% voltage regulator
efficiency.
5.3 Thermal Solution
This information is only a guideline for the systems being constructed and is not intended to be a
substitute for system builder verification, validation, and testing on the reliability and
effectiveness of a thermal solution.
5.3.1 AMD Opteron™ Processor Thermal Solution Guidelines
For reliable operation of AMD Opteron processor-based systems, the selection of the correct
thermal solution is critical. For a list of heatsink suppliers that have developed products designed
to support AMD Opteron processors, please visit our Web site.
http://www.amd.com/us-en/Processors/TechnicalResources/0,,30_182_869_8819^9396,00.html
In EMEA, for a list of heatsink suppliers that have developed products designed to support
AMD Opteron processors, please visit our Web site.
http://www.amd.com/opteronhardware
This selection of suppliers found at these Web sites is frequently updated and not intended to be a
comprehensive listing of all heatsinks that support AMD Opteron processors.
5.3.2 Thermally Tested Populated Chassis Server Solutions for
AMD Opteron™ Processor
AMD internal labs have tested the thermal performance of the server solutions outlined on our
Web site at
http://www.amd.com/us-en/Processors/ProductInformation/0,,30_118_8796_8819^9398,00.html. In
EMEA, please visit
http://www.amd.com/opteronhardware. A thermally tested server solution is defined
as chassis, heatsink(s), motherboard, and power supply. This testing is strictly limited to a thermal
evaluation under AMD’s internal tests for AMD Opteron processors at speeds to be released
through the end of 2004 and does not include electromagnetic interference (EMI), or other
component testing or considerations. Furthermore, AMD has not conducted individual thermal or
functional testing on the power supplies and heatsinks in these systems.