EM78P312N
8-Bit Microcontroller
64
• Product Specification (V1.0) 10.03.2006
(This specification is subject to change without further notice)
APPENDIX
A Package Types:
OTP MCU Package Type Pin Count Package Size
EM78P312NP DIP 28 600 mil
EM78P312NK SDIP 28 400 mil
EM78P312NAK SDIP 28 300 mil
EM78P312NM SOP 28 300 mil
EM78P312NS SSOP 28 209 mil
Y/S/J：Green product does not contain hazardous substances.
The third edition of Sony SS-00259 standard.
Pb content should be less than 100ppm.
Pb content to fit in with Sony spec.
Part No. EM78P311SxY EM78P311SxS/xJ
Electroplate type Sn/Cu Pure Tin
Ingredient (%) Cu:1.0~3.0% Sn :100%
Melting point(°C) ~227°C 232°C
Electrical resistivity
(μΩ-cm)
13 11.4
Hardness (hv) 10~12 8~10
Elongation (%) 40% >50%
